Optimizing Pulse Energy for 355 nm UV Laser Marking of Glass Microhole Arrays with Crack Lengths <20 µm
Abstract:
The precision and quality of glass microhole arrays are critical in various industries, including electronics, medical, and aerospace. This article explores the use of 355 nm ultraviolet (UV) laser marking technology to create microhole arrays in glass with controlled crack lengths. We focus on optimizing pulse energy to ensure crack lengths remain below 20 µm, which is essential for maintaining the structural integrity and functionality of the glass components.
Introduction:
Glass microhole arrays are widely used in applications requiring high precision and minimal material deformation. Traditional mechanical drilling methods can cause excessive heat, stress, and material removal, leading to deformation and reduced quality. UV laser marking offers a non-contact, precise alternative with the potential for minimal heat-affected zones (HAZ) and reduced stress. The 355 nm wavelength is particularly effective for glass due to its high absorption coefficient in the UV spectrum.
Materials and Methods:
We conducted experiments using a 355 nm UV laser marking machine on glass substrates to create microhole arrays. The pulse energy was varied to study its effect on crack length. The laser system was equipped with a high-precision galvanometer scanner to control the laser beam's movement and ensure accurate microhole placement. The experiments were conducted under controlled environmental conditions to minimize external factors affecting the results.
Results:
Our findings indicate that the pulse energy plays a crucial role in determining the crack length in glass microhole arrays. At low pulse energies, the laser was unable to penetrate the glass surface effectively, resulting in incomplete holes and longer cracks. Conversely, at high pulse energies, the laser caused excessive material removal and longer cracks due to thermal stress. We identified an optimal pulse energy window that resulted in crack lengths consistently below 20 µm.
Discussion:
The optimal pulse energy for creating microhole arrays in glass with crack lengths less than 20 µm was found to be dependent on several factors, including the glass type, laser fluence, and pulse duration. By carefully adjusting these parameters, we were able to achieve the desired crack length while maintaining the glass's structural integrity. The use of a 355 nm UV laser marking machine allowed for precise control over these parameters, leading to consistent and high-quality microhole arrays.
Conclusion:
This study demonstrates the potential of 355 nm UV laser marking technology in creating high-quality glass microhole arrays with controlled crack lengths. By optimizing pulse energy, we can achieve the desired precision and quality required for various applications. Further research is needed to explore the long-term stability and durability of these microhole arrays under different environmental conditions.
Keywords: UV Laser Marking, Glass Microhole Arrays, Pulse Energy, Crack Length, Laser Marking Machine
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